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AlN Substrate

Specific Information
As a typical representative of the fourth-generation semiconductor materials, aluminum nitride(AlN) has superior physical and chemical properties such as ultra-wide bandgap, high thermal conductivity, high breakdown field strength, corrosion resistance, and radiation resistance.It is especially suitable for the manufacture of opto-electronics devices,dielectric layers in optical storage media,electronic substrates, chip carriers.
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  • specification
  • Properties
  •                           
     
    Item AlN Substrate(1~2inch)
    Diameter 25.4±0.3mm 50.8±0.5mm
    Thickness 400±50μm 400±50μm
    Crystal Type 2H
    Surface Orientation (0001) ± 0.5°
    Primary Flat Orientation (10-10) ± 5.0˚
    Secondary Flat Orientation Al face up: 90.0˚ CW from Primary ± 5.0˚
    Front Surface Finish Al face:≤ 0.5 nm
    Back Surface Finish N face:≤ 1.2μm
    Laser Mark Back side:N-Face
    TTV ≤25μm ≤30μm
    BOW ≤30μm ≤35μm
    WARP ≤40μm ≤45μm
    Edge Exclusion ≤5 mm

     

    Customization specifications:

    * Various sizes and shapes such as 10*10mm.

    * Special orientations like non-polar M-plane AlN crystal substrate.

    * Various surface roughness such as slicing,lapping.
     

  • Aluminum nitride(AlN) is a solid nitride of aluminium,white or off-white.It exists primarily in the hexagonal wurtzite crystal structure, but also has a metastable cubic zincblende phase, which is synthesized primarily in the form of thin films.AlN has the electrically insulating nature and high thermal conductivity.

     

    Crystal Structure Hexagonal 
    Lattice Constant(nm) a=0.3112Å  c=0.4982Å
    Density(g/cm3) 3.23
    Melting point(℃) 2750
    Mohs Hardness(mohs) 9
    Dielectric Constant 8.15
    Band Gap(eV) 6.2
    Breakdown Electrical Field (MV/cm) 11.7
    Thermal Conductivity(W/cm.K) 4.8
    Thermal Expansion  4. 84*10-6/k

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