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2 inch SiC Wafer (6H-N Type)

Specific Information
6H-N type silicon carbide (6H-N SiC) is an n-type doped silicon carbide single crystal with a hexagonal (6H) crystal structure, typically achieved through nitrogen (N) doping. It exhibits high electron mobility, excellent thermal conductivity, a wide bandgap (~3.0 eV), and superior resistance to high temperatures and radiation. These properties make it ideal for high-frequency and high-power electronic devices, such as RF power amplifiers, Schottky diodes, and MOSFETs.
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  • specification
  • Properties
  •                   
     
    Item 6H-N type SiC substrate(2~6inch)
    Diameter 50.8±0.3mm 100.0±0.3mm 150.0±0.5mm
    Thickness 430±25μm 430±25μm 430±25μm
    Surface Orientation On-Axis:<0001>±0.5°
    Primary Flat Orientation Parallel to <10-10>±5°
    Primary Flat Length 16.0±1.5mm 32.5±2.0mm 32.5±2.0mm
    Secondary Flat Orientation Silicon face up: 90° CW. from Primary flat±5.0°
    Secondary Flat Length 8.0±1.5mm 18.0±2.0mm 18.0±2.0mm
    Resistivity 0.01~0.02 Ω·cm
    Front Surface Finish Si-Face: CMP, Ra<0.5nm
    Back Surface Finish C-Face: Optical Polish, Ra<1.0nm
    Laser Mark Back side: C-Face
    TTV ≤10μm ≤15μm ≤15μm
    BOW ≤25μm ≤30μm ≤40μm
    WARP ≤30μm ≤40μm ≤60μm
    Edge Exclusion ≤3 mm

     

    Customization specifications:

    * Various sizes and shapes such as 5*5mm,10*10mm

    * Various thicknesses:0.1~20mm

    * Various surface roughness such as slicing,lapping,polishing.

    * Silicon carbide crystal ingots are available.

  • Silicon carbide substrates(SiC) are the third-generation semiconductor materials and belong to Wide Band Gap Semiconductors. Silicon carbide(SiC) is a group IV-IV compound semiconductor material formed by C and Si elements in a ratio of 1:1 and has the characteristics of high temperature resistance, high critical breakdown electric field, high electron saturation migration rate and high thermal conductivity. Compared with silicon-based power devices, Silicon carbide devices will greatly improve the energy conversion efficiency because of its high voltage, high temperature and low loss. It will be one of the most basic and widely used materials for making semiconductor chips in the future.

     

    Crystal Structure Hexagonal
    Lattice Constant(nm) a=0.308Å c=1.512Å 
    Density(g/cm3) 3.0
    Stacking Sequence  ABCACB
    Mohs Hardness(mohs) 9.2
    Dielectric Constant 9.66
    Band Gap(eV) 3.0
    Breakdown Electrical Field (MV/cm) 2-5*106
    Thermal Conductivity(W/cm.K) 4.9
    Thermal Expansion 

    4.2*10-6/k

    Refractive Index  ~2.6

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