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2 inch SiC Wafer (6H-P Type)

Specific Information
6H-P type silicon carbide (6H-P SiC) is a P-type doped silicon carbide material with a 6H crystal structure, characterized by a wide bandgap (~3.02 eV), high thermal conductivity, and a high breakdown electric field. P-type doping is typically achieved by introducing aluminum (Al) or boron (B), resulting in hole conductivity. 6H-SiC exhibits higher carrier mobility compared to 4H-SiC, making it advantageous for certain high-power electronic and RF applications. However, due to its strong anisotropy, it is less commonly used in power device applications compared to 4H-SiC.
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  • specification
  • Properties
  •                         
     
    Item 6H-P type SiC substrate(2~6inch)
    Diameter 50.8±0.3mm 100.0±0.3mm 150.0±0.5mm
    Thickness 350±25μm 350±25μm 350±25μm
    Surface Orientation Off-Axis:2°-4°toward <11-20>±0.5°
    Primary Flat Orientation Parallel to <10-10>±5°
    Primary Flat Length 16.0±1.5mm 32.5±2.0mm 32.5±2.0mm
    Secondary Flat Orientation Silicon face up: 90° CW. from Primary flat±5.0°
    Secondary Flat Length 8.0±1.5mm 18.0±2.0mm 18.0±2.0mm
    Resistivity ≤0.1Ω•cm ≤0.3Ω•cm ≤0.3Ω•cm
    Front Surface Finish Si-Face: CMP, Ra<0.5nm
    Back Surface Finish C-Face: Optical Polish, Ra<1.0nm
    Laser Mark Back side: C-Face
    TTV ≤10μm ≤15μm ≤15μm
    BOW ≤25μm ≤30μm ≤40μm
    WARP ≤30μm ≤40μm ≤60μm
    Edge Exclusion ≤3 mm

     

    Customization specifications:

    * Various sizes and shapes such as 5*5mm,10*10mm

    * Various thicknesses:0.1~20mm

    * Various surface roughness such as slicing,lapping,polishing.

    * Silicon carbide crystal ingots are available.

  • Silicon carbide substrates(SiC) are the third-generation semiconductor materials and belong to Wide Band Gap Semiconductors. Silicon carbide(SiC) is a group IV-IV compound semiconductor material formed by C and Si elements in a ratio of 1:1 and has the characteristics of high temperature resistance, high critical breakdown electric field, high electron saturation migration rate and high thermal conductivity. Compared with silicon-based power devices, Silicon carbide devices will greatly improve the energy conversion efficiency because of its high voltage, high temperature and low loss. It will be one of the most basic and widely used materials for making semiconductor chips in the future.

     

    Crystal Structure Hexagonal
    Lattice Constant(nm) a=3.09Å c=15.084Å 
    Density(g/cm3) 3.0
    Stacking Sequence  ACBABC
    Mohs Hardness(mohs) 9.2
    Dielectric Constant 9.66
    Band Gap(eV) 3.02
    Breakdown Electrical Field (MV/cm) 2-5*106
    Thermal Conductivity(W/cm.K) 3-5
    Thermal Expansion 

    4.3*10-6/k

    4.7*10-6/k

    Refractive Index  2.612~2.651

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